PRODUCTS AND SERVICES
4-6 inch oxidized silicon wafers
Double-sided oxidation/single-sided oxidation Oxide layer thickness 50um-2um
4-6 inch polished silicon wafers
Dual throw/single throw/easy throw 3-8 inches, TIR<10um
3-8 inch ground wafers
Double-sided grinding 3-8 inches, thickness tolerance <10um
3-8 inch single crystal ingots
Specifiable target resistivity range 3-8 inches, roundable, slicable
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